MB400 Electronic Grade Polishing Resins
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| Item # | Item Name | Functional Groups | Volume Ratio | Total Exchange Capacity | Water Retention Capacity | |
|---|---|---|---|---|---|---|
| H + Form | MB400, 45 to 50 Percent (%) Water Retention Capacity Electronic Grade Polishing Resin | Sulfonic Acid | 40 % | 1.8 eq/l min | 45 to 50 % | |
| OH - Form | MB400, 53 to 60 Percent (%) Water Retention Capacity Electronic Grade Polishing Resin | Quaternary Amine | 60 % | 1 eq/l min | 53 to 60 % |